MIM
Lead Frame
Moly
Selective Plating
Electro Plating
Insert Molding
               

             

     

 

 

 
 

LED INSERT MOLDING

 

 
   
 

SMD5050

機械&物理特性
Dimension 5.0 x 5.0 x 1.0 (mm)
Tablet Dimension 144 x 60 x 0.30 (mm)
Number of SMD pieces 120 pieces
Metallic Material Alloy 194
Plastic Material PPA-4122
Number of Pins 4 Pins

Plating Method

&

Thickness

Silver Plating at Functional area 3.0um(120u”)MIN.

Nickel Based 0.3um MIN.

Light Reflect Angle 120 degrees
Plating Glossiness GAM > 1.0
CAD圖面

 

 

 

  

 

SMD5620

機械&物理特性
Dimension 5.6 x 2.0 x 0.7 (mm)
Tablet Dimension 144 x 60 x 0.25 (mm)
Number of SMD pieces 320 pieces
Metallic Material Alloy 194
Plastic Material PA9T-TA112(White)
Number of Pins 2 Pins

Plating Method

&

Thickness

Cu: Strike 15 u” MIN. Ag: 90  u”  MIN.
Plating Glossiness GAM > 1.2
CAD圖面

 

 

 

 

 

SMD5630

機械&物理特性
Dimension 5.6 x 3.0 x 0.9 (mm)
Tablet Dimension 260.5 x 70 x 0.20 (mm)
Number of SMD pieces 240 pieces
Metallic Material Alloy 194
Plastic Material PA9T-TA112(White)
Number of Pins 4 Pins

Plating Method

&

Thickness

Silver Plating at Functional area 2.0um(80u”)MIN. + Cu Strike
Plating Glossiness 120 degrees
CAD圖面

 

 

 

 

 

高功率LED

機械&物理特性
Dimension 8.0 x 3.05 x 7.2 (mm)
Tablet Dimension 160.0 x 60 x 0.25 (mm)
Number of SMD pieces 64 pieces
Metallic Material Alloy 194
Plastic Material LCP-S135(Black)
Number of Pins 2 Pins

Plating Method

&

Thickness

Gold Plating at Functional area 0.02um(0.8u”)MIN. + Ni Strike 0.5um MIN.

Or Selective Silver Plating, Spec depends on customer requirements

Plating Glossiness GAM >1.0 (silver Plating)
CAD圖面

 

 

 

 

 

 

                              
 
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