TSM has engaged in designing and manufacturing quality lead frames for almost 10 years. TSM has strong capability in designing a variety of precise molds and has advanced production technology available to meet its customer needs.
TSM’s R+D team has continually developed lead framesused in power transistor, by using different stamping, forming and plating etc. technologies to meet the needs of its globe customers.
Single lead frame
1.Transistor:
* TO220 / 263 / 265. TO3P. TO247
* ITO220. Dualraw TO220 / 3P / ITO220
2.Folded SMA,SMB,SMC
Application
| 1.LEAD FRAME |
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| 1.1 應用成品 |
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1.2 應用成品 |
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Semiconductor, LED, Passive components
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| TO-3P |
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TO-220 |
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| TO-263 |
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BRIDGE RECTIFIER |
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| SMA |
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SMB |
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| SMC |
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bare copper lead frame
( TO-3P / 220 / 263 / 93... )
(ITO-220...) |
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seletive plated and spot plated lead frames
( TO220 / 263 / 93，ITO-220… ) |
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Steel Disc
Diameter 0.7~5.0 mm
Thickness 0.190 mm |
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