MIM
Lead Frame
Moly
Selective Plating
Electro Plating
Insert Molding
               

             

     

 

 

 
 

MIM

Copper Based

 

 

Material :

Copper

Characteristics :

Good Conductivity and Heat Dissipation

Dimension :

65 x 31 x 9 mm

Weight :

55 Grams
Application : Fiber Optic Housing

 

 

 

Material :

Copper

Characteristics :

Good Conductivity and Heat Dissipation

Dimension :

29.5 x 29.5 x 3 mm

Weight :

10 Grams
Application : CPU Heat Sink

 

 

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  © Copyright 2007  Taiwan Sintered Metals Co., Ltd.  
  Taiwan Sintered Metals Co., Ltd. (T):886-2-2268-2837  (F): 886-2-2269-4804  
  All rights reserved.   1Fl., No. 25-1, Tzyh Chyang St., TuCheng Dist.,
        New Taipei City, Taiwan, R.O.C.  
        E-Mail:sales@tsm.com.tw